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System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

Frontiers in Energy 2018, Volume 12, Issue 1,   Pages 109-120 doi: 10.1007/s11708-018-0540-8

Abstract: Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot

Keywords： thermoelectric cooling     thermal management     optimization     high flux electronics    

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On-Chip LiDAR Technology Advances for Cars, Cell Phones

Mitch Leslie

Engineering 2022, Volume 18, Issue 11,   Pages 3-5 doi: 10.1016/j.eng.2022.09.003

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Super-Resolution Displacement Spectroscopic Sensing over a Surface “Rainbow” Article

Lyu Zhou, Nan Zhang, Chang Chieh Hsu, Matthew Singer, Xie Zeng, Yizheng Li, Haomin Song, Josep Jornet, Yun Wu, Qiaoqiang Gan

Engineering 2022, Volume 17, Issue 10,   Pages 75-81 doi: 10.1016/j.eng.2022.03.018

Abstract: For these applications, miniaturized spectrometers are desirable to enable the on-chip analysis of spectralHere, we report a unique “rainbow” trapping metasurface for on-chip spectrometers and sensorsmanipulation of efficiently coupled rainbow plasmonic resonances reveals a new platform for miniaturized on-chipUsing this low-setting 4× microscope imaging system, we demonstrate a biosensing resolution ofusing exosomal epidermal growth factor receptor (EGFR) expression values, thereby demonstrating a new on-chip

Keywords： Rainbow trapping     Metasurface     Surface plasmon polaritons     Super-resolution displacement     On-chip biosensing    

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A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Review

Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia

Engineering 2023, Volume 26, Issue 7,   Pages 185-197 doi: 10.1016/j.eng.2022.10.019

Abstract: Heterogeneous integration (HI) can be at the chip level (a single chip with multiple hotspots), in multi-chipFlux values have increased exponentially with a simultaneous reduction in chip size and a significantEmbedded cooling eliminates most sequential conduction resistance from the chip to the ambient, unlikeAlthough embedding the cooling solution onto an electronic chip results in a high heat transfer potential

Keywords： Electronic cooling     Embedded cooling     Immersion cooling    

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Optimization Strategy of MPEG-4 AAC Decoder on a Low-cost SoC

Gao Gugang,Shi Longxing,Pu Hanlai,Zhou Fan

Strategic Study of CAE 2007, Volume 9, Issue 10,   Pages 60-64

Abstract: fix-point conversion scheme based on statistical analysis and performance oriented customizing scheme for on-chip

Keywords： software optimization     SoC     FFC     on-chip memory     AAC    

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Chip-based waveguides for high-sensitivity biosensing and super-resolution imaging Review Articles

Chen-lei Pang, Xu Liu, Wei Chen, Qing Yang,qingyang@zju.edu.cn

Frontiers of Information Technology & Electronic Engineering 2020, Volume 21, Issue 8,   Pages 1134-1149 doi: 10.1631/FITEE.1900211

Abstract: In this review, we introduce some chip-based waveguide biosensing and imaging techniques, which significantlyCombined with recently developed chip-based light sources, these techniques offer the possibility ofbiosensing and super-resolution imaging based on integrated circuits.

Keywords： Waveguide-based sensing     Waveguide-based imaging     Evanescent illumination     Frequency shifting and stitching    

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Frontiers of Mechanical Engineering 2012, Volume 7, Issue 1,   Pages 29-37 doi: 10.1007/s11465-012-0314-7

Abstract: Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chipvibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chipThe flip chip analytical model is revised by considering the influence of spring mass on mechanical energyThis revised model is then applied to estimate the flip chip resonance frequencies.Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection

Keywords： flip chip     defect detection     ultrasonic excitation     vibration analysis    

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On-chip optical interconnect using visible light Article

Wei CAI, Bing-cheng ZHU, Xu-min GAO, Yong-chao YANG, Jia-lei YUAN, Gui-xia ZHU, Yong-jin WANG, Peter GRÜNBERG

Frontiers of Information Technology & Electronic Engineering 2017, Volume 18, Issue 9,   Pages 1288-1294 doi: 10.1631/FITEE.1601720

Abstract: Monolithic optical interconnect chip integrates the emitter,waveguide, base, and collector into a multi-componentin-plane visible light communication to light-inducedartificial synaptic devices, intelligent display, on-chip

Keywords： Homogeneous integration     Multiple-quantum-well diode     Visible light interconnection     Coexistence of light emission and photodetection    

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2,   Pages 118-126 doi: 10.1007/s11465-013-0253-y

Abstract:

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control

Keywords： LED chip sorter     multi-domain modeling and simulation     parameter optimization     modelica language    

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 581-590 doi: 10.1007/s11465-017-0454-x

Abstract:

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set

Keywords： electric field microsensor     three-dimensional     single-chip     in-plane rotation    

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4,   Pages 472-472 doi: 10.1007/s11465-009-0077-y

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 3,   Pages 448-457 doi: 10.15302/J-FASE-2023490

Abstract:

● Low-value biowaste including wood chip and potato peel was valorized

Keywords： Aspen Plus     co-gasification     potato peel     syngas     simulation     waste reduction     wood chip    

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3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 2,   Pages 203-214 doi: 10.1007/s11465-017-0421-6

Abstract: simulations were performed under different cutting conditions to obtain realistic numerical predictions of chipnotable advantages, such as capability to easily handle any type of tool geometry and any side effect on chipThe proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip

Keywords： 3D finite element modeling     micro end-milling     cutting force     chip formation     burr formation    

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Engineered Vasculature for Organ-on-a-Chip Systems Review

Abdellah Aazmi, Hongzhao Zhou, Yuting Li, Mengfei Yu, Xiaobin Xu, Yutong Wu, Liang Ma, Bin Zhang, Huayong Yang

Engineering 2022, Volume 9, Issue 2,   Pages 131-147 doi: 10.1016/j.eng.2021.06.020

Abstract:

Organ-on-a-chip technology, a promising three-dimensional (3D) dynamic culture method, ensures accurateThus, it is essential to integrate the circulatory system into an organ-on-a-chip to recreate tissueThis review discusses the synergy between the vasculature and the emerging organ-on-a-chip technologyIn addition, we review the different steps of a vascularized organ-on-a-chip fabrication process, including

Keywords： Organ-on-a-chip     Vasculature     Bioprinting     Tumor-on-a-chip    

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Three-Dimensional Chip Imaging

Marcus Woo

Engineering 2020, Volume 6, Issue 5,   Pages 485-486 doi: 10.1016/j.eng.2020.03.009

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Title Author Date Type Operation

System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

Journal Article

On-Chip LiDAR Technology Advances for Cars, Cell Phones

Mitch Leslie

Journal Article

Super-Resolution Displacement Spectroscopic Sensing over a Surface “Rainbow”

Lyu Zhou, Nan Zhang, Chang Chieh Hsu, Matthew Singer, Xie Zeng, Yizheng Li, Haomin Song, Josep Jornet, Yun Wu, Qiaoqiang Gan

Journal Article

A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated

Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia

Journal Article

Optimization Strategy of MPEG-4 AAC Decoder on a Low-cost SoC

Gao Gugang,Shi Longxing,Pu Hanlai,Zhou Fan

Journal Article

Chip-based waveguides for high-sensitivity biosensing and super-resolution imaging

Chen-lei Pang, Xu Liu, Wei Chen, Qing Yang,qingyang@zju.edu.cn

Journal Article

Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Journal Article

On-chip optical interconnect using visible light

Wei CAI, Bing-cheng ZHU, Xu-min GAO, Yong-chao YANG, Jia-lei YUAN, Gui-xia ZHU, Yong-jin WANG, Peter GRÜNBERG

Journal Article

Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Journal Article

Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Journal Article

Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Journal Article

SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Journal Article

3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

Journal Article

Engineered Vasculature for Organ-on-a-Chip Systems

Abdellah Aazmi, Hongzhao Zhou, Yuting Li, Mengfei Yu, Xiaobin Xu, Yutong Wu, Liang Ma, Bin Zhang, Huayong Yang

Journal Article

Three-Dimensional Chip Imaging

Marcus Woo

Journal Article